The Senior Process Engineer will lead the development, optimization, and scale-up of our micro-LED display manufacturing technology. Responsibility includes extensive hands-on experience in die-level bonding techniques, with a deep understanding of the full semiconductor process flow, including lithography and metal deposition. This position plays the lead role in both prototype fabrication and transferring technology from R&D to high-volume manufacturing.
JOB DUTIES AND RESPONSIBILITIES:
- Develop, characterize, and optimize indium bump formation processes:
- Vacuum deposition (sputtering/evaporation) of under bump metal (UBM) and Indium
- Photolithography and lift-off patterning
- Bump geometry, pitch scaling, and bump surface quality
- Lead the process development of thermo-compression bonding for Chip-to-chip/die-to-die application:
- Design, execute, and analyze Design of Experiments (DOE) to characterize process windows, identify key control parameters, and improve bond yield, uniformity, and reliability.
- Perform root cause analysis for bonding-related failures (e.g., misalignment, non-contact, cracked die, high resistance) using SEM, FIB, X-ray and electrical testing
- Collaborate closely with equipment suppliers to perform both Indium bumping process and bonding trials at equipment vendor sites (travel required).
- Responsible for new tool qualifications, oversee preventative maintenances.
- Interface with chip and wafer supplier to ensure incoming material quality and compatibility with the bonding process.
- Develop and document robust process specifications, work instructions, and training materials for technicians.
- Implement Statistical Process Control (SPC) methodologies to monitor process stability and drive continuous improvement initiatives.
- Remains current with the latest advancements in advanced packaging, bonding techniques, and mass transfer technologies.
MINIMUM JOB QUALIFICATIONS:
- Kopin is a defense contractor and is subject to International Traffic in Arms Regulations (ITAR). You must be a US Citizen or Permanent Resident (green card holder) to be considered for this position.
- A Bachelor of Science with exceptional demonstrated experience will be considered. M.S. or Ph.D. in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, or a related field, preferred.
- 8+ years of hands-on experience in semiconductor process engineering, with a specific focus on die-level bonding, advanced packaging, or assembly.
- Proven, in-depth experience with one or more of the following is strongly preferred:
- Indium bumping process
- Thermo-Compression Bonding (TCB)
- Flip-Chip Attach process and materials
- Strong experience with bonding metrology and failure analysis techniques (C-SAM, X-ray, SEM/EDX, bond pull/shear testing).
- Strong foundational experience in other key semiconductor unit processes:
- Lithography: Hands-on experience with photoresist processing (coat, expose, develop), overlay registration, and critical dimension control. Knowledge of steppers/scanners is essential.
- Metal Deposition: Practical knowledge of Physical Vapor Deposition (PVD) techniques such as sputtering and evaporation for depositing adhesion layers, diffusion barriers, and seed layers (e.g., Ti, Cu, Al).
- Working Knowledge of silicon wafer dicing and coring processes, experience in wafer-to-chip singulation, yield improving, and minimizing die damages through data-driven process engineering.
- Proficiency in data analysis tools such as JMP, Minitab and experience with SPC and DOE.
- Deep understanding of interface science, solder metallurgy, and intermetallic compound (IMC) formation.
- Exceptional problem-solving skills and a data-driven, analytical approach to root cause investigation.
- Meticulous attention to detail and a relentless focus on yield and quality.
- Strong ability to work collaboratively in a cross-functional team environment.
- Excellent communication skills for effectively reporting findings and recommendations to both technical and management/leadership audiences.
- Self-motivated and capable of managing multiple projects in a fast-paced, startup-like environment.
PREFERRED QUALIFICATIONS
- M.S. or Ph.D. in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics, or a related field preferred. A Bachelor of Science with exceptional demonstrated experience will be considered.
- Direct experience in Micro-LED, LED, or photonics fabrication and integration.
- Experience with thin-film transistor (TFT) backplane integration.
- Knowledge of wafer-level packaging processes.
- Experience in a high-volume manufacturing (HVM) environment and bringing processes from NPI to production.
- Familiarity with equipment from key vendors in the bonding and packaging space.
PHYSICAL REQUIREMENTS:
- Work is performed in an office environment and requires the ability to operate standard office equipment. Prolonged periods sitting at a desk and working on a computer. Must have the ability to lift 15 pounds and carry small parcels, packages, and other items, walk short distances, and gown according to clean room protocols as required.
**The approximate salary range for this position is $130,000 to $150,000 annually, plus bonus**
