A leading innovator in semiconductor process equipment and advanced materials engineering is seeking an experienced Director of Engineering to drive the design, development, and delivery of next-generation semiconductor capital equipment. This is a high-impact leadership position that will oversee multi-disciplinary engineering functions—mechanical, electrical, software, and process—to accelerate product development and ensure technical excellence across all stages of production.
Key Responsibilities:
- Provide strategic leadership to a cross-functional engineering organization developing complex semiconductor tools and systems.
- Define and execute engineering roadmaps that align with company growth, product innovation, and technology scaling objectives.
- Lead efforts in equipment design, system integration, and design for manufacturability (DFM) to improve tool reliability, cost efficiency, and throughput.
- Oversee the design and deployment of atomic layer deposition (ALD), chemical vapor deposition (CVD), or physical vapor deposition (PVD) systems and subsystems.
- Ensure all engineering deliverables meet or exceed SEMI, ISO 9001, and CE standards, as well as cleanroom and vacuum system requirements.
- Collaborate closely with operations, manufacturing, and supply chain teams to scale production globally while maintaining process consistency and product quality.
- Partner with sales, service, and customer engineering teams to translate user requirements into robust and reliable design solutions.
- Establish and track engineering performance metrics such as yield, reliability, uptime, and time-to-market.
- Lead root cause analysis and continuous improvement initiatives to resolve product, field, and production issues.
- Champion best practices in project management, innovation, and cross-functional collaboration across global teams.
Qualifications:
- Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, or related field.
- Minimum of 12 years of experience in semiconductor capital equipment, including at least 5 years in a senior leadership role.
- Proven success managing multi-disciplinary engineering teams in a high-tech or cleanroom manufacturing environment.
- Expertise in vacuum systems, robotics, wafer handling, process modules, and semiconductor process integration.
- Hands-on knowledge of ALD, CVD, PVD, or similar thin-film deposition technologies.
- Deep understanding of SEMI safety standards (S2/S8), system-level design, and complex electro-mechanical integration.
- Exceptional leadership, communication, and organizational development skills.
- Ability to collaborate across global engineering, manufacturing, and service teams.
Why Join:
- Lead engineering for a fast-growing semiconductor equipment innovator at the forefront of surface engineering and nanotechnology.
- Work in a collaborative, innovation-driven culture focused on technological excellence and customer success.
- Compensation: Base salary $128,000 - $168,000 (commensurate with experience)
- Competitive compensation and benefits, including comprehensive medical, dental, and vision insurance, 401(k) with company match, PTO, and professional growth opportunities.
Additional Details:
- Travel: Up to 15% (domestic and international).
- Work Environment: On-site, with required use of standard safety and PPE equipment in lab and production areas.
