A leading innovator in semiconductor process equipment and advanced materials engineering is seeking an experienced Director of Engineering to drive the design, development, and delivery of next-generation semiconductor capital equipment. This is a high-impact leadership position that will oversee multi-disciplinary engineering functions—mechanical, electrical, software, and process—to accelerate product development and ensure technical excellence across all stages of production.

Key Responsibilities:

Provide strategic leadership to a cross-functional engineering organization developing complex semiconductor tools and systems.
Define and execute engineering roadmaps that align with company growth, product innovation, and technology scaling objectives.
Lead efforts in equipment design, system integration, and design for manufacturability (DFM) to improve tool reliability, cost efficiency, and throughput.
Oversee the design and deployment of atomic layer deposition (ALD), chemical vapor deposition (CVD), or physical vapor deposition (PVD) systems and subsystems.
Ensure all engineering deliverables meet or exceed SEMI, ISO 9001, and CE standards, as well as cleanroom and vacuum system requirements.
Collaborate closely with operations, manufacturing, and supply chain teams to scale production globally while maintaining process consistency and product quality.
Partner with sales, service, and customer engineering teams to translate user requirements into robust and reliable design solutions.
Establish and track engineering performance metrics such as yield, reliability, uptime, and time-to-market.
Lead root cause analysis and continuous improvement initiatives to resolve product, field, and production issues.
Champion best practices in project management, innovation, and cross-functional collaboration across global teams.

Qualifications:

Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, or related field.
Minimum of 12 years of experience in semiconductor capital equipment, including at least 5 years in a senior leadership role.
Proven success managing multi-disciplinary engineering teams in a high-tech or cleanroom manufacturing environment.
Expertise in vacuum systems, robotics, wafer handling, process modules, and semiconductor process integration.
Hands-on knowledge of ALD, CVD, PVD, or similar thin-film deposition technologies.
Deep understanding of SEMI safety standards (S2/S8), system-level design, and complex electro-mechanical integration.
Exceptional leadership, communication, and organizational development skills.
Ability to collaborate across global engineering, manufacturing, and service teams.

Why Join:

Lead engineering for a fast-growing semiconductor equipment innovator at the forefront of surface engineering and nanotechnology.
Work in a collaborative, innovation-driven culture focused on technological excellence and customer success.
Compensation: Base salary $128,000 - $168,000 (commensurate with experience)
Competitive compensation and benefits, including comprehensive medical, dental, and vision insurance, 401(k) with company match, PTO, and professional growth opportunities.

Additional Details:

Travel: Up to 15% (domestic and international).
Work Environment: On-site, with required use of standard safety and PPE equipment in lab and production areas.

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Director of Engineering

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